ODB++ Data Exchange Format

The standard for high-level data exchange. Enhancing communication efficiencies between design, fabrication and manufacturing stages.

ODB++ is the most intelligent CAD/CAM data exchange format available today, capturing all CAD/EDA, assembly and PCB fabrication knowledge in one single, unified database. Originally developed by Valor Computerized Systems for use in its own PCB CAD/CAM systems, Genesis 2000, Enterprise 3000 and Trilogy , ODB++ has already become widely accepted as the de facto industry standard, providing unprecedented power to PCB design, fabrication and assembly, with the flexibility to expand as required. In parallel, ODB++ is providing most of the technological basis for the new IPC2581 standard for data exchange in the PCB fabrication and assembly industry.

The NEMI (National Electronics Manufacturing Initiative) has conducted an industry survey to determine which of the currently used CAD/CAM data exchange formats are most favored in the electronics industry. ODB++ emerged as the clear winner, capturing the majority of industry votes and was selected as the starting point to develop a single converged industry data exchange format.

Unique, Expandable Structure
ODB++ is an ASCII open format, capturing a vast knowledge base gleaned from the PCB design, fabrication and assembly arenas. Some formats, such as Gerber and Excellon, are too simplistic and ambiguous by nature. Other proposed standards have an implicit, CAD-like structure, which may lead to misinterpretation of data. But ODB++ combines an explicit structure with an unprecedented level of intelligence to describe the fully assembled PCB, with all constituent parts.

Features
• Includes a wide range of system attributes such as impedance, plated/non-plated holes, layers connected by specific holes, etc.
• WYSIWYG description of layers eliminates ambiguities.
• Attributes at the single feature level.
• Unique board layer and order definitions.
• Hierarchical support for data placed in panel layers.
• Accurate modeling of component packages and pins.
• Supports merging of BOM data
• Installed and in use at over 2000 Sites worldwide
• Interfaces already exist from multiple Open Systems Alliance partners, including Cadence and Mentor. 

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