Fiducial and Component Analysis
Fiducial Analysis
Global Fiducial Summary
Local Fiducial Summary
Non Uniform Local Fiducial
Fiducial to Copper
Fiducial to Hole
Close Fiducials
Far Fiducials
Fiducial Close to Rout
Fiducial Far from Rout
Fiducial To Like Pad
Fiducial to Conveyed Edge
Fiducial To Background
Fiducial To Solder Mask
Fiducial To Solderpaste
Fiducials to Silk Screen
Component Center Fiducial
Component Covers Fiducial
Component Local Fiducial
Component Global Fiducial
Coarse-pitch Component Global Fiducial |
Component Analysis
Comp. Max Height
Comp. Pitch
Comp. Rotation
Comp. Length Min
Comp. Length Max
Assembled Board Thickness
Comp. Spacing
Comp. To Toeprint
Other Side Area Keepout
Rout Spacing
SMT Component To Conveyed Edge
Comp. Touch Silkscreen
Component To Conveyed Edge
Carrier Wall Spacing
PTH To Carrier Wall
NPTH To Carrier Wall
Via To Carrier Wall
Label To Component
Comp. To Gold Fingers
Component To Tooling Hole
Component To Mounting Hole
Hole Under Component |
Uncapped Via Under Component
No Orientation Indication
Component Uncommon Orientation
Wrong Orientation Indication
No Square Pad on THMT pin #1
Chip Edge Protection Missing
Chip Corner Protection Missing
Comp. Outside Keepin Area
Comp. Within Keepout Area
Comp. Exceed Max Height
Comp. Under Min Height
Component To Exposed Via
Trace Under Component
Comp. To Reference Designator
Comp. Without Reference Designator
Misplaced Reference Designator
Wave Solder Component Orientation
Component Relative Orientation |